OFC: TRUMPF announces availability of High Data Rate Photodiode and VCSEL

Ulm/San Francisco, March 28^th, 2025 – TRUMPF Photonic Components, a global leader in VCSEL and photodiode solutions for data communication makes data transmission in data centers even more efficient. The high-tech company announced today the availability of its newest 112Gbps PAM4 InGaAs PIN photodiode, and 56Gbps VCSEL, further strengthening its product portfolio in datacom space.

The 112Gbps PAM4 InGaAs PIN photodiode features operation over 842nm to 948nm wavelengths with active area diameter of 32µm. In addition, it has low bias voltage, and low dark current, enhancing the performance for 112Gbps applications. The photodiode samples are available for customer evaluation.

TRUMPF also released high temperature performing 850nm, 56Gbps VCSEL which delivers robust, linear performance over an expanded temperature range from 0 °C to 105 °C.  Furthermore, leveraging its industry-leading narrow spectral width, the VCSEL enables transmission up to 400+ meters, opening it up to innovative uses inside a data center.

“We have long heritage and core strength in GaAs technology which we leveraged to develop a photodiode which delivers excellent performance at 112Gbps data rate. With the release of this photodiode, and upcoming availability of 112Gbps VCSEL this summer, we will have a complete portfolio of 112Gbps solutions to address the demands of today and the future,” said Ralph Gudde, Vice President of Marketing and Sales at TRUMPF Photonic Components. “While we expand the product family going up in data rate, our new high temperature performing 56 Gbps VCSEL offers extra design margins and reaches longer distances enabling innovative uses inside a data center” he added.

TRUMPF continues to invest heavily in its technology for higher data rates and is offering both VCSELs and photodiodes as a matching-pair solution in various layouts like singlets, 1x2, 1x4, 1x8 and/or 1x12 arrays. The devices are specifically designed to meet the demands of data centers including for AI/ML, high-performance computing, and other bandwidth-intensive applications, as they deliver stable and reliable data transmission at high speeds.

Visit TRUMPF Photonic Components at OFC 2025, Booth 6345.

Digital images in printable resolution are available to accompany this press release. They must only be used for editorial purposes. Usage is free of charge if the source is cited as follows: "Photo: TRUMPF". Changes to the graphics – with the exception of cropping of the main motif – are not permitted. Additional photos are available in the TRUMPF Media Pool.