TRUMPF to present next-generation VCSEL devices for LPO and CPO at ECOC 2024

Ulm/Frankfurt, September 24, 2024 – TRUMPF Photonic Components, a global leader in VCSEL and photodiode solutions for data communication, will present upcoming advances in VCSEL technology aimed at meeting the evolving demands of the future datacom market.

“These improvements focus on increasing functionality per chip area to support low-noise LPO links and densely integrated CPO technology”, said Roman Koerner, Head of Research & Development at TRUMPF Photonic Components. Key innovations include subwavelength gratings to reduce RIN and burst noise, as well as composite VCSELs for improved single-mode robustness, faster speed and lower thermal impedance. Designed for wavelengths like 1060nm and 1310nm to minimize fiber attenuation, this technology will play a crucial role in the next generation of high-performance optical transceivers.

Advanced optical data communication systems benefit from the high-speed data transmission which the VCSEL-based technology offers. TRUMPF continues to invest heavily in its technology for higher data rates and is offering both VCSELs and photodiodes as a matching pair solution in various layouts like singlets, 1x2, 1x4, 1x8 and/or 1x12 arrays. The VCSELs are specifically designed to meet the demands of data centers, AI/ML, high-performance computing, and other bandwidth-intensive applications, as they deliver stable and reliable data transmission at high speeds. 

Visit TRUMPF Photonic Components at ECOC 2024, Booth C81

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