Ultrashort pulse lasers from the TruMicro Series 5000 impress with extremely short pulses of less than 10 ps, as well as high pulse energies of up to 500 μJ. They vaporize virtually every material so quickly that heat influence cannot be detected. The patented two-stage laser power control with integrated external modulator makes the laser completely stable, from pulse to pulse and across the entire power range. The peak pulse powers are up to 40 MW.
Micro-materials processing: maximum productivity
The short and ultrashort pulse lasers from TRUMPF enable microprocessing with an optimal combination of quality, productivity, and profitability, with no limits in terms of industrial suitability. The particular pulse and power stability is achieved through the separation of pulse generation and pulse output. The patented control ensures monitoring of each individual pulse, and keeps the power and pulse energy at exactly the right level required for the application. The picosecond lasers of the TruMicro Series 5000 impress with their high pulse energy of up to 500 μJ. All of this together with excellent beam quality and high average powers of up to 150 W. This ensures maximum productivity in micro-materials processing. They vaporize virtually every material so quickly that heat influence cannot be detected. They are therefore, ideal for processing semiconductor materials, metals, dielectrics, plastics, and glasses.
The ultrafast power modulator keeps power and pulse energy at an exact level.
Process temperature-sensitive materials without significant heat input.
TruMicro lasers can be integrated easily and are compatible with all common interfaces.
100% of the average power even in individual pulses as a result of regenerative disk technology
The lasers, which are based on the successful TruMicro Series 5000, are designed for your everyday production tasks.
Laser cutting of glass
When laser cutting glass, the mechanical load of the material is reduced to a minimum with a TruMicro ultrashort pulse laser – there are no cracks at the edges, which means that the cut components no longer need to be smoothed down. In the display industry in particular, chemically hardened glass is used as durable protective glass and carrier substrate, and must be cut.
High-speed laser cutting of glass
Lasers currently represent the only low-impact and flexible process for cutting chemically hardened glass with a high breaking resistance. After the hardening process, the laser and the TOP Cleave cutting optics can be used to separate the glass with outstanding edge quality.
Flexible geometries
Unlike mechanical processes, with the laser you can also use the wear-free, non-contact process for flexible two- and three-dimensional geometries. The picosecond lasers of the TruMicro Series 5000 are the perfect tool here.
Laser-cut stent
In the production of stents, burr-free cutting areas and edges are crucial. Picosecond lasers enable production without the need for reworking, and increase the output for the production of stents made from nitinol. The ultrashort pulse technology makes it possible to cut these bioresorbable stents made from the extremely heat-sensitive shape-memory alloy.
High-precision structuring of sapphire
Sapphire protects the high-resolution cameras in smartphones, and is used as a substrate in LED production and as cover glass in high-quality products. It is extremely durable and hard. This makes conventional methods very difficult to use to process sapphire efficiently without cracks. With a laser from the TruMicro Series 5000, you can achieve a quality that does not require rework.
Laser-cut sapphire sample
The picosecond lasers of the TruMicro Series 5000 enable fine geometries to be cut to a high quality. The high average power of the picosecond lasers also ensures maximum productivity.
PCB drilling made easy
Modern printed circuit boards are designed with multiple layers and are therefore particularly compact. Holes lined with copper connect the traces between the levels. Here, the drilled holes often have a diameter of less than 100 μm. The picosecond lasers take care of this task in just one operation. The high available peak pulse powers enable the desired geometry and quality to be achieved, combined with extremely high productivity.
Micro-drilling in the circuit board substrate
In the detail view of a bore hole of the circuit board substrate, you can see the quality with which the TruMicro lasers carry out the processing. The high available peak pulse powers are a primary element for this, and also increase productivity.
Laser holes in a ceramic plate
Good electrical insulating properties turn technical ceramics such as aluminum nitride, aluminum oxide, silicon nitride, and zirconium oxide into highly sought-after materials. With the picosecond lasers you can create bore holes in these materials with the smallest diameters and in high quality.
Laser processing of brittle-hard materials (ceramic, glass, sapphire)
The lasers from the TruMicro Series 5000 enable high-quality processing of brittle-hard materials, such as ceramic. Drilling and cutting thin ceramic is a task for the picosecond laser. With its help, you can achieve the smallest diameters in a high quality.
Micro-holes in thin tungsten
Grid-shaped arrangement of micro-holes with a diameter of approx. 70 micrometers in 0.2 mm thin tungsten.
TruMicro 5050
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TruMicro 5070
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TruMicro 5080
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TruMicro 5250
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TruMicro 5270
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TruMicro 5280
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TruMicro 5350
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TruMicro 5370
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TruMicro 5380
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Laser parameters | |||||||||
Average output power | 50 W | 100 W | 150 W | 30 W | 60 W | 90 W | 15 W | 30 W | 45 W |
Beam quality (M²) | < 1.3 Standard, M² < 1.2 optional | < 1.3 Standard, M² < 1.2 optional | < 1.3 Standard, M² < 1.2 optional | < 1.3 Standard, M² < 1.2 optional | < 1.3 Standard, M² < 1.2 optional | < 1.3 Standard, M² < 1.2 optional | < 1.3 Standard, M² < 1.2 optional | < 1.3 Standard, M² < 1.2 optional | < 1.3 Standard, M² < 1.2 optional |
Wavelength | 1030 nm | 1030 nm | 1030 nm | 515 nm | 515 nm | 515 nm | 343 nm | 343 nm | 343 nm |
Pulse duration | < 10 ps | < 10 ps | < 10 ps | < 10 ps | < 10 ps | < 10 ps | < 10 ps | < 10 ps | < 10 ps |
Maximum pulse energy | 500 µJ | 500 µJ | 250 µJ | 150 µJ | 150 µJ | 150 µJ | 75 µJ | 75 µJ | 75 µJ |
Minimum repetition rate | 100 kHz | 200 kHz | 600 kHz | 200 kHz | 400 kHz | 600 kHz | 200 kHz | 400 kHz | 600 kHz |
Maximum repetition rate | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz |
Structural design | |||||||||
Dimensions of laser head (W x H x D) | 680 mm x 289 mm x 1060 mm | 680 mm x 289 mm x 1060 mm | 680 mm x 289 mm x 1060 mm | 680 mm x 289 mm x 1060 mm | 680 mm x 289 mm x 1060 mm | 680 mm x 289 mm x 1060 mm | 680 mm x 289 mm x 1060 mm | 680 mm x 289 mm x 1060 mm | 680 mm x 289 mm x 1060 mm |
Dimensions of supply unit (W x H x D) | 442 mm x 1192 mm x 910 mm | 442 mm x 1192 mm x 910 mm | 442 mm x 1192 mm x 910 mm | 442 mm x 1192 mm x 910 mm | 442 mm x 1192 mm x 910 mm | 442 mm x 1192 mm x 910 mm | 442 mm x 1192 mm x 910 mm | 442 mm x 1192 mm x 910 mm | 442 mm x 1192 mm x 910 mm |
Installation | |||||||||
Protection class | IP54 | IP54 | IP54 | IP54 | IP54 | IP54 | IP54 | IP54 | IP54 |
Ambient temperature | 20 °C - 30 °C | 20 °C - 30 °C | 20 °C - 30 °C | 20 °C - 30 °C | 20 °C - 30 °C | 20 °C - 30 °C | 20 °C - 30 °C | 20 °C - 30 °C | 20 °C - 30 °C |
TruMicro 5050
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TruMicro 5070
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TruMicro 5080
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TruMicro 5250
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TruMicro 5270
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TruMicro 5280
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TruMicro 5350
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TruMicro 5370
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TruMicro 5380
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Laser parameters | |||||||||
Average output power | 50 W | 100 W | 150 W | 30 W | 60 W | 90 W | 15 W | 30 W | 45 W |
Beam quality (M²) | < 1.3 Standard, M² < 1.2 optional | < 1.3 Standard, M² < 1.2 optional | < 1.3 Standard, M² < 1.2 optional | < 1.3 Standard, M² < 1.2 optional | < 1.3 Standard, M² < 1.2 optional | < 1.3 Standard, M² < 1.2 optional | < 1.3 Standard, M² < 1.2 optional | < 1.3 Standard, M² < 1.2 optional | < 1.3 Standard, M² < 1.2 optional |
Wavelength | 1030 nm | 1030 nm | 1030 nm | 515 nm | 515 nm | 515 nm | 343 nm | 343 nm | 343 nm |
Pulse duration | < 10 ps | < 10 ps | < 10 ps | < 10 ps | < 10 ps | < 10 ps | < 10 ps | < 10 ps | < 10 ps |
Maximum pulse energy | 500 µJ | 500 µJ | 250 µJ | 150 µJ | 150 µJ | 150 µJ | 75 µJ | 75 µJ | 75 µJ |
Minimum repetition rate | 100 kHz | 200 kHz | 600 kHz | 200 kHz | 400 kHz | 600 kHz | 200 kHz | 400 kHz | 600 kHz |
Maximum repetition rate | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz |
Structural design | |||||||||
Dimensions of laser head (W x H x D) | 680 mm x 289 mm x 1060 mm | 680 mm x 289 mm x 1060 mm | 680 mm x 289 mm x 1060 mm | 680 mm x 289 mm x 1060 mm | 680 mm x 289 mm x 1060 mm | 680 mm x 289 mm x 1060 mm | 680 mm x 289 mm x 1060 mm | 680 mm x 289 mm x 1060 mm | 680 mm x 289 mm x 1060 mm |
Dimensions of supply unit (W x H x D) | 442 mm x 1192 mm x 910 mm | 442 mm x 1192 mm x 910 mm | 442 mm x 1192 mm x 910 mm | 442 mm x 1192 mm x 910 mm | 442 mm x 1192 mm x 910 mm | 442 mm x 1192 mm x 910 mm | 442 mm x 1192 mm x 910 mm | 442 mm x 1192 mm x 910 mm | 442 mm x 1192 mm x 910 mm |
Installation | |||||||||
Protection class | IP54 | IP54 | IP54 | IP54 | IP54 | IP54 | IP54 | IP54 | IP54 |
Ambient temperature | 20 °C - 30 °C | 20 °C - 30 °C | 20 °C - 30 °C | 20 °C - 30 °C | 20 °C - 30 °C | 20 °C - 30 °C | 20 °C - 30 °C | 20 °C - 30 °C | 20 °C - 30 °C |
The technical data of all product versions as a download.
TruControl
TruControl is the quick and easy-to-use control for TRUMPF solid-state lasers. It regulates the laser power in real time in order to deliver reproducible results. TruControl manages, controls, and visualizes the interface configuration. You benefit from a uniform control architecture across all laser technologies. The lasers have interfaces to control intelligent TRUMPF optics, such as monitored CFO focusing optics or PFO scanner optics. You can easily program the processing optics via the laser control system. The remote support service provided by TRUMPF means that you receive off-site support within seconds. This will allow you to avoid service calls or be as prepared as possible and increase the availability of the laser device.
Useful additional options of the TruMicro Series 5000 lasers enable you to work more efficiently and with more process reliability
Interfaces are key for the integration of a TruMicro laser in your machine or production line. The solid-state lasers from TRUMPF offer interfaces to all common fieldbus systems. Also available: real-time interface, parallel digital I/O, interface for process sensor systems, OPC UA software interface, analog input board, interface for intelligent TRUMPF optics (CFO, PFO).
In the event of a fault, TRUMPF service experts will remotely access your laser via a secure remote connection. In many cases the fault can be remedied directly in this way, or the configuration of the laser can be modified in a way that permits you to continue manufacturing until the spare part arrives.
TRUMPF offers you all the components you need for beam guidance from the laser to the workpiece. This also applies for various focusing optics which have proven themselves to be precise and reliable over many years of industrial use. The optics can be easily integrated – both in stand-alone processing stations as well as in complete production lines. The modular structure enables the optics to be continually adapted to the laser types as well as various processing situations.
TOP Cleave cutting optics
The TOP Cleave-2 focusing optics are processing optics for high-dynamic cutting of transparent materials, such as glass or sapphire.
Ultrashort laser pulses are not only ultrashort; they also achieve peak values for pulse qualities such as energy and power. To ensure that the correct pulse is applied on the workpiece despite the peak intensity, special beam guidance and formation elements are required. TRUMPF offers beam switches, deflectors, beam expanders, and polarization optics that are optimized for use with ultrashort pulse lasers.
TruMicro deflectors are well-suited for ultrashort laser pulses for guiding the laser beam while maintaining the pulse parameters.
A beam splitter enables two light paths to be powered at the same time, each with half the laser power, as well as two workpieces to be processed at the same time. The mechanical setting makes it possible to adjust the divided power precisely to the uniform distribution in both beam arms.
With beam switches, the laser light can be guided in two light paths for different workpieces. The pilot laser enables simple adjustment of the beam guidance.
Circular polarized light is produced from linear polarized light with the help of a quarter wave plate and makes it possible to achieve consistent processing results for applications with directional production geometries.
This product range and information may vary depending on the country. Subject to changes to technology, equipment, price, and range of accessories. Please get in touch with your local contact person to find out whether the product is available in your country.
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