LDMOS chiller made of pure copper
General industry
TruPrint
Copper
Additive manufacturing
The use of an additively manufactured cooler made of pure copper boosts cooling capacity for the LDMOS chips (laterally-diffused metal-oxide semiconductor chips) and permits over-clocking to enhance performance. The printed copper has a heat conductivity of 394 W/(m*K).
Improved cooling efficiency
€30 per part
100% IACS conductivity
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Facts & figures about the example part
Material: pure copper
Weight: 13.7 g
Build time: 24 h (75 parts for 100 mm round substrate plate)
Created by: TRUMPF