TruMicro Series 5000, quick and cost-effective

Short and ultrashort pulse lasers

TruMicro Series 5000

Quick and cost-effective

REQUEST OFFER

Overview

Applications

Technical data

Software

Options

Focusing optics

Micro-materials processing: maximum productivity

The short and ultrashort pulse lasers from TRUMPF enable microprocessing with an optimal combination of quality, productivity, and profitability, with no limits in terms of industrial suitability. The particular pulse and power stability is achieved through the separation of pulse generation and pulse output. The patented control ensures monitoring of each individual pulse, and keeps the power and pulse energy at exactly the right level required for the application. The picosecond lasers of the TruMicro Series 5000 impress with their high pulse energy of up to 500 μJ. All of this together with excellent beam quality and average powers of up to 150 W. This ensures maximum productivity in micro-materials processing. They vaporize virtually every material so quickly that heat influence cannot be detected. They are therefore, ideal for processing semiconductor materials, metals, dielectrics, plastics, and glasses.

100% tailored pulses

The ultrafast power modulator keeps power and pulse energy at an exact level.

All-around capability for cool tasks

Process temperature-sensitive materials without significant heat input.

Integration made easy

TruMicro lasers can be integrated easily and are compatible with all common interfaces.

Full power

100% of the average power even in individual pulses as a result of regenerative disk technology

Limitless industrial suitability

The lasers, which are based on the successful TruMicro Series 5000, are designed for your everyday production tasks.

Optical arrangement of the TruMicro Series 5000

Highly stable for optimal quality

Ultrashort pulse lasers from the TruMicro Series 5000 impress with extremely short pulses of less than 10 ps, as well as high pulse energies of up to 500 μJ. They vaporize virtually every material so quickly that heat influence cannot be detected. The patented two-stage laser power control with integrated external modulator makes the laser completely stable, from pulse to pulse and across the entire power range. The peak pulse powers are up to 40 MW.

Targeted heat input with the TruMicro Series 5000

Zero or targeted heat input

With laser pulses of a few picoseconds, materials can be efficiently processed, virtually without thermal or mechanical influences. To do this, the laser pulse – and therefore the duration of the energy input – must be short enough in order to avoid temperature compensation between electrons and their associated atoms. The material evaporates abruptly. The heat does not get into the surrounding material, and thermal stress fractures are avoided. This is referred to as "cold processing". For metals and many other materials, the ideal pulse duration for this is between 1 and 10 picoseconds.

Laser cutting of glass

When laser cutting glass, the mechanical load of the material is reduced to a minimum with a TruMicro ultrashort pulse laser – there are no cracks at the edges, which means that the cut components no longer need to be smoothed down. In the display industry in particular, chemically hardened glass is used as durable protective glass and carrier substrate, and must be cut.

High-speed laser cutting of glass

Lasers currently represent the only low-impact and flexible process for cutting chemically hardened glass with a high breaking resistance. After the hardening process, the laser and the TOP Cleave cutting optics can be used to separate the glass with outstanding edge quality.

Flexible geometries

Unlike mechanical processes, with the laser you can also use the wear-free, non-contact process for flexible two- and three-dimensional geometries. The picosecond lasers of the TruMicro Series 5000 are the perfect tool here.

Laser-cut stent

In the production of stents, burr-free cutting areas and edges are crucial. Picosecond lasers enable production without the need for reworking, and increase the output for the production of stents made from nitinol. The ultrashort pulse technology makes it possible to cut these bioresorbable stents made from the extremely heat-sensitive shape-memory alloy.

High-precision structuring of sapphire

Sapphire protects the high-resolution cameras in smartphones, and is used as a substrate in LED production and as cover glass in high-quality products. It is extremely durable and hard. This makes conventional methods very difficult to use to process sapphire efficiently without cracks. With a laser from the TruMicro Series 5000, you can achieve a quality that does not require rework.

Sapphire sample cut using a picosecond laser of the TruMicro Series 5000

Laser-cut sapphire sample

The picosecond lasers of the TruMicro Series 5000 enable fine geometries to be cut to a high quality. The high average power of the picosecond lasers also ensures maximum productivity.

Laser drilling a printed circuit board with a laser of the TruMicro Series 5000.

PCB drilling made easy

Modern printed circuit boards are designed with multiple layers and are therefore particularly compact. Holes lined with copper connect the traces between the levels. Here, the drilled holes often have a diameter of less than 100 μm. The picosecond lasers take care of this task in just one operation. The high available peak pulse powers enable the desired geometry and quality to be achieved, combined with extremely high productivity.

Micro-drilling in the circuit board substrate

In the detail view of a bore hole of the circuit board substrate, you can see the quality with which the TruMicro lasers carry out the processing. The high available peak pulse powers are a primary element for this, and also increase productivity.

Laser holes in a ceramic plate

Good electrical insulating properties turn technical ceramics such as aluminum nitride, aluminum oxide, silicon nitride, and zirconium oxide into highly sought-after materials. With the picosecond lasers you can create bore holes in these materials with the smallest diameters and in high quality.

Laser processing of brittle-hard materials (ceramic, glass, sapphire)

The lasers from the TruMicro Series 5000 enable high-quality processing of brittle-hard materials, such as ceramic. Drilling and cutting thin ceramic is a task for the picosecond laser. With its help, you can achieve the smallest diameters in a high quality.

Micro-holes in thin tungsten

Grid-shaped arrangement of micro-holes with a diameter of approx. 70 micrometers in 0.2 mm thin tungsten.

Cancel

Compare products

Starting product Your starting product

1st comparison model 2nd comparison model (optional)

Compare now

TruMicro 5050
TruMicro 5070
TruMicro 5080
TruMicro 5250
TruMicro 5270
TruMicro 5280
TruMicro 5350
TruMicro 5370
TruMicro 5380

	TruMicro 5050 Compare product	TruMicro 5070 Compare product	TruMicro 5080 Compare product	TruMicro 5250 Compare product	TruMicro 5270 Compare product	TruMicro 5280 Compare product	TruMicro 5350 Compare product	TruMicro 5370 Compare product	TruMicro 5380 Compare product
Laser parameters
Average output power	50 W	100 W	150 W	30 W	60 W	90 W	15 W	30 W	45 W
Beam quality (M²)	< 1.3 Standard, M² < 1.2 optional	< 1.3 Standard, M² < 1.2 optional	< 1.3 Standard, M² < 1.2 optional	< 1.3 Standard, M² < 1.2 optional	< 1.3 Standard, M² < 1.2 optional	< 1.3 Standard, M² < 1.2 optional	< 1.3 Standard, M² < 1.2 optional	< 1.3 Standard, M² < 1.2 optional	< 1.3 Standard, M² < 1.2 optional
Wavelength	1030 nm	1030 nm	1030 nm	515 nm	515 nm	515 nm	343 nm	343 nm	343 nm
Pulse duration	< 10 ps	< 10 ps	< 10 ps	< 10 ps	< 10 ps	< 10 ps	< 10 ps	< 10 ps	< 10 ps
Maximum pulse energy	500 µJ	500 µJ	250 µJ	150 µJ	150 µJ	150 µJ	75 µJ	75 µJ	75 µJ
Minimum repetition rate	100 kHz	200 kHz	600 kHz	200 kHz	400 kHz	600 kHz	200 kHz	400 kHz	600 kHz
Maximum repetition rate	1000 kHz	1000 kHz	1000 kHz	1000 kHz	1000 kHz	1000 kHz	1000 kHz	1000 kHz	1000 kHz
Structural design
Dimensions of laser head (W x H x D)	680 mm x 289 mm x 1060 mm	680 mm x 289 mm x 1060 mm	680 mm x 289 mm x 1060 mm	680 mm x 289 mm x 1060 mm	680 mm x 289 mm x 1060 mm	680 mm x 289 mm x 1060 mm	680 mm x 289 mm x 1060 mm	680 mm x 289 mm x 1060 mm	680 mm x 289 mm x 1060 mm
Dimensions of supply unit (W x H x D)	442 mm x 1192 mm x 910 mm	442 mm x 1192 mm x 910 mm	442 mm x 1192 mm x 910 mm	442 mm x 1192 mm x 910 mm	442 mm x 1192 mm x 910 mm	442 mm x 1192 mm x 910 mm	442 mm x 1192 mm x 910 mm	442 mm x 1192 mm x 910 mm	442 mm x 1192 mm x 910 mm
Installation
Protection class	IP54	IP54	IP54	IP54	IP54	IP54	IP54	IP54	IP54
Ambient temperature	20 °C - 30 °C	20 °C - 30 °C	20 °C - 30 °C	20 °C - 30 °C	20 °C - 30 °C	20 °C - 30 °C	20 °C - 30 °C	20 °C - 30 °C	20 °C - 30 °C

Compare products End comparison End comparison	TruMicro 5050	TruMicro 5070	TruMicro 5080	TruMicro 5250	TruMicro 5270	TruMicro 5280	TruMicro 5350	TruMicro 5370	TruMicro 5380
Laser parameters
Average output power	50 W	100 W	150 W	30 W	60 W	90 W	15 W	30 W	45 W
Beam quality (M²)	< 1.3 Standard, M² < 1.2 optional	< 1.3 Standard, M² < 1.2 optional	< 1.3 Standard, M² < 1.2 optional	< 1.3 Standard, M² < 1.2 optional	< 1.3 Standard, M² < 1.2 optional	< 1.3 Standard, M² < 1.2 optional	< 1.3 Standard, M² < 1.2 optional	< 1.3 Standard, M² < 1.2 optional	< 1.3 Standard, M² < 1.2 optional
Wavelength	1030 nm	1030 nm	1030 nm	515 nm	515 nm	515 nm	343 nm	343 nm	343 nm
Pulse duration	< 10 ps	< 10 ps	< 10 ps	< 10 ps	< 10 ps	< 10 ps	< 10 ps	< 10 ps	< 10 ps
Maximum pulse energy	500 µJ	500 µJ	250 µJ	150 µJ	150 µJ	150 µJ	75 µJ	75 µJ	75 µJ
Minimum repetition rate	100 kHz	200 kHz	600 kHz	200 kHz	400 kHz	600 kHz	200 kHz	400 kHz	600 kHz
Maximum repetition rate	1000 kHz	1000 kHz	1000 kHz	1000 kHz	1000 kHz	1000 kHz	1000 kHz	1000 kHz	1000 kHz
Structural design
Dimensions of laser head (W x H x D)	680 mm x 289 mm x 1060 mm	680 mm x 289 mm x 1060 mm	680 mm x 289 mm x 1060 mm	680 mm x 289 mm x 1060 mm	680 mm x 289 mm x 1060 mm	680 mm x 289 mm x 1060 mm	680 mm x 289 mm x 1060 mm	680 mm x 289 mm x 1060 mm	680 mm x 289 mm x 1060 mm
Dimensions of supply unit (W x H x D)	442 mm x 1192 mm x 910 mm	442 mm x 1192 mm x 910 mm	442 mm x 1192 mm x 910 mm	442 mm x 1192 mm x 910 mm	442 mm x 1192 mm x 910 mm	442 mm x 1192 mm x 910 mm	442 mm x 1192 mm x 910 mm	442 mm x 1192 mm x 910 mm	442 mm x 1192 mm x 910 mm
Installation
Protection class	IP54	IP54	IP54	IP54	IP54	IP54	IP54	IP54	IP54
Ambient temperature	20 °C - 30 °C	20 °C - 30 °C	20 °C - 30 °C	20 °C - 30 °C	20 °C - 30 °C	20 °C - 30 °C	20 °C - 30 °C	20 °C - 30 °C	20 °C - 30 °C

PDF <1MB

Technical data sheet

The technical data of all product versions as a download.

TruControl

TruControl is the quick and easy-to-use control for TRUMPF solid-state lasers. It regulates the laser power in real time in order to deliver reproducible results. TruControl manages, controls, and visualizes the interface configuration. You benefit from a uniform control architecture across all laser technologies. The lasers have interfaces to control intelligent TRUMPF optics, such as monitored CFO focusing optics or PFO scanner optics. You can easily program the processing optics via the laser control system. The remote support service provided by TRUMPF means that you receive off-site support within seconds. This will allow you to avoid service calls or be as prepared as possible and increase the availability of the laser device.

TO PRODUCT

Useful additional options of the TruMicro Series 5000 lasers enable you to work more efficiently and with more process reliability

Condition Monitoring

Have your laser monitored by our TRUMPF experts and algorithms. We contact you proactively at the first signs of anything unusual. This avoids unplanned downtimes in your production.

Digital connection and integration for smart solutions

Seamless integration of multiple TRUMPF machines into your own software environment is very easy. We have the right solution for every combination, whether it be integration into Oseon or a connection to monitoring and analysis tools. A connection to third-party software systems is also possible with our interfaces based on the OPC UA standard.

TRUMPF offers you all the components you need for beam guidance from the laser to the workpiece. This also applies for various focusing optics which have proven themselves to be precise and reliable over many years of industrial use. The optics can be easily integrated – both in stand-alone processing stations as well as in complete production lines. The modular structure enables the optics to be continually adapted to the laser types as well as various processing situations.

TOP Cleave cutting optics

The TOP Cleave-2 PRO focusing optics are processing optics for high-dynamic cutting of transparent materials, such as glass or sapphire.

TOP Cleave-2 PRO

High-speed laser cutting of glass

TOP Weld processing optics

The innovative processing optics for welding transparent materials without intermediate layers.

TOP Cleave-2 PRO

High-speed laser cutting of glass

Scanner

TOP Cleave-2 PRO

High-speed laser cutting of glass

This product range and information may vary depending on the country. Subject to changes to technology, equipment, price, and range of accessories. Please get in touch with your local contact person to find out whether the product is available in your country.